Research Papers

Research Papers

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Pressure drop across heat sink is one of the key variables and we propose a modified analytical method to estimate the channel velocity and use it to calculate the total heat sink pressure drop through different theoretical pressure drop equations. The theoretical results produced from the theoretical equations were compared against results gathered from experimental study and
numerical method.

 

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The orientation of a heat pipe plays an important role in its
performance. The performance of a heat pipe under specific
orientations is directly related to its wick structure. The objective of this paper is to conduct a comparative study on heat pipe performance with different wick structures subjected to different orientations. The published results may serve as a reference for mechanical and electrical engineers when they try to incorporate heat pipes into their thermal solutions.

 

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Modern portable electronics have seen component heat loads increasing, while the space available for heat dissipation has decreased, both factors working against the thermal designer. The primary goal of this paper is to find the optimization points for several different fan-heat sink designs. The secondary goal is to find a theoretical methodology that will accurately predict the optimization point and the expected performance.

 

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Experimentation to characterize the heat sink
performance is often performed under different procedures
and apparatuses specifically catered to the knowledge of
the individual in the thermal testing laboratory. When
simulating the heat load of the electronics package, the
conventional practice is to use resistance heating elements
such as cartridge resistive heaters or flexible thin film
heaters. Recently, thermoelectric devices (TED) are also
being used as the heat source in heat sink laboratory
experiments.

 

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There are three manufacturing methods for bonding
the folded fin to the base of heat sink: adhesive bonding,
soldering, and brazing. This paper presents the theoretical study of thermal contact resistance of the epoxy bonded or solder bonded joint between the folded fin base and the spreader plate of heat sink, and also presents the experimental results which support this theory.

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