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Speak with one of our Thermal Engineers now. We are standing by to assist you with any questions. Email High Heat Load Heat Sink![]() Download Power Heat Sink PDF (64k) Heat Sink Design Goals and Constraints
Heat Sink Solution:
The Power Heat Sink was designed to remove 150 Watts of heat, generated by a high heat flux package. Because the application demanded high heat sink performance in limited space, it required a highly efficient heat sink solution. Heat pipes were used to maximize the efficiency of the heat sink fins by taking the heat from the heat sink base and transferring it to the top of the heat sink fins. Secondly, the heat pipes increased heat spreading across the heat sink base, further increasing the overall heat sink efficiency. By adding heat pipes, the heat sink solution was able to dissipate 25-30% more heat at the same temperature increase.
Aluminum was used to maintain low weight as well as the low cost of the heat sink solution. The lower weight allows the Power Heat Sink to reduce the problem of excessive stress on the processor and PCB. To achieve cost effectiveness, Enertron has developed a proprietary fabrication process to manufacture Power Heat Sink and integrating the heat pipes into the fins of the heat sinks. Several other variations of the heat pipe integrated, Power Heat Sink have since been designed. The Power Heat Sink is highly customizable for a variety of heat loads and space constraints. To learn more about High Heat Load cooling and power heat sink design, or if you have an application you would like to discuss, please call one of our engineers at 1-877-ENERTRON (1-877-363-7876). |