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Speak with one of our Thermal Engineers now. We are standing by to assist you with any questions. Email  High Capacity Power Electronics Heat Sink Download High Capacity Power Electronics Heat Sink PDF (67k) Heat Sink Design Goals and Constraints
Heat Sink Solution:
Due to space constraints, a finned heat sink could not be directly mounted to the power electronics. The area adjacent to the power electronics, on both sides, was available to place a heat sink solution. Airflow was also adequate in these areas. A copper base plate served as the heat collector, which mounted directly to the power electronics. Enertron engineers used 8 large high capacity heat pipes to form an efficient thermal path from the heat sink base plate to the heat sink fin arrays. Tightly spaced heat sink fin structures were fitted to the ends of each heat pipe. The small heat sink fin size ensured a small pressure drop, while ensuring that the heat sink fin efficiency remained high. Two 225mm diameter axial fans provided the required airflow. 
As a primary concern in the design phase, the heat sink solution was designed to have a low cost when manufactured in small quantities. The same heat sink fin design was used on all heat pipes. The heat pipes were standard items. The copper plates had to be CNC machined, but their design was kept simple to reduce machining time. The tooling investment was minimal, in that the only stamping tooling that was required was for the heat sink fins. The total cost of the initial shipment was less than the previous heat sink solution's tooling. To learn more about high capacity power electronics cooling and heat sink design, or if you have an application you would like to discuss, please call one of our engineers at 1-877-ENERTRON (1-877-363-7876).  |
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