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Copper heatsink

Heat Sink Design Goals and Constraints

  • Processors produce as much as 70 Watts of heat
  • Maximum junction temperature of 74°C
  • Compact heat sink design required
  • For use in all-in-one desktop system
  • Route heat via heat pipe to vented area

Heat Sink Solution:

Heat Pipe Heatsink

Enertron engineers worked closely with the customer to determine the available space for the heat sink solution. Due to the compact nature of the all-in-one desktop computer design, space for the heat sink was very limited. Enertron engineers chose to use heat pipes to carry the heat from the processor to the heat sink. The heat sink was comprised of an array of copper fins, through which the heat pipes passed. The heat sink copper fins provide high fin efficiency while remaining very thin. Due to the high density of heat sink fins, a large convective surface area was created. Two 40 x 40 mm axial fans were used to provide the required airflow. The total thermal resistance (q) of the heat pipe integrated heat sink solution was 0.60°C/W.


Heat Sink Manufacturing

To provide a strong mechanical backbone to the heat pipe heat sink system, an aluminum housing was designed. The housing mechanically joined the heat collector to the heat sink, thus preventing stress on the heat pipes. The fans were fastened to the heat sink housing, thus creating a single thermal heat pipe heat sink solution, ready to be installed into the system.


To learn more about compact heat pipe CPU cooling, or if you have an application you would like to discuss, please call one of our engineers at 1-877-ENERTRON (1-877-363-7876).

Heat Pipe And Thermal Solutions